Join
Proto save
£0.30
Loading...
This heat sink compound or thermal paste is designed for thermal coupling and will increase thermal conductivity in electronic components while providing efficient heat dissipation to keep them cool.Features and Benefits Has high thermal conductivity to maximise heat transfer between the heat sink and heat source Provides excellent resistance to moisture to protect exposed components Formulated with a low metallic impurity content to ensure effective heat transfer between the heat generating component and the mechanical heat sinkTypical Applications Printed circuit boards Electronic components Control assembliesStandards ISO 9001:2015Warnings Do not mix with other products Do not use on energised equipment
| Applications | Industrial Electronics Sealing | Printed Circuit Boards |
| Compatible Materials | Electronic Components |
| Product Composition | Paste |
| Colour | White |
| MFR Part No. | 1031241 |
| Product Type | Thermally-Conductive Sealant |
| Features | High Thermal Conductivity | Moisture Buffer |
| Pack Type | Syringe |
| Temperature Resistance Range | 50 to 300\u00b0C |
| Series | Heat Sink |
Payment & Security
Payment methods
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.
